We Have More Than 40 Years of Experience. [email protected]
ban
News Center
  1. Home > 
  2. mega smartfill PERU
mega smartfill PERU

mega smartfill PERU

Advanced (Smart) Fill - Semiconductor EngineeringEach new process technology comes with many new design rules related to fill. For example, at 20nm fill shapes must be evenly distributed and also require a greater variety of fill shapes. Designers need to add fill not just to metal layers, but also to poly, diffusion, and via layers. In Missing: PERU

[email protected]
CONTACT CONTACT US

Are You Looking for A Consultant?

toTop
Click avatar to contact us
Hi,may I help you with products, price, etc?
Chat Online